One-stop PCBA Solution Service Provider

PCB Design

DFMA Service

PCB Assembly

Assembly Test

PCB Manufacturing

Compoent Purching

Types of Leadless BGAs: We provide assembly for a wide ange of leadless parts We can handle the following types of BGAs and more:

• Plastic BGA(PBGA)

• Thin Chip Array Ball Grid Array (TCBGA)

• Micro BGA

• Chip Array Ball Grid Array (CABGA)

• Ceramic BGA(CBGA)

• Very Thin Chip Array Ball Grid Array (CVBGA)

• Micro Fine Line BGA(MBGA)

• Very Fine Pitch Ball Grid Array (VFBGA)

• Stack BGAs

• Chip scale Package(CSP)

• Lead BGA and leadless BGA

• Wafer level chip scale packaging (WLCSP)

•Land Grid Array (LGA)

Testing and Inspection: BGA Assembly with X-ray Inspection, and functional testing and Automated Optical Inspection(AOl) services

• Passive Footprints: The chip packages are provided in passive footprints

• Sizes: Sizes ranging from 2mm x 3mm/1x1mm to 45mm/50x50mm.

• Pitch Sizes: Minimum pitch sizes 0.4mm and placement accuracy +/- 0.03 mm

• BGA Assembly and Rework: We can rework on circuit boards up to 36 layers with 65mm squares.

BGA(Ball Grid Array)

EBGA 680L

LBGA 160L

PBGA 217L

SBGA 192L

TSBGA 680L