Flexible Circuit Board(FPC)

JH PCBA Flexible PCB

Single layer to 12 layer flex PCB manufacturing service. Different stiffener materials: Fr4, PI, Aluminum, different flex materials such as Doupont, Panasonic etc are available

What is Flexible circuit boards?

Flexible circuit boards also named as Flex PCB or Flexible PCB, manufactured by base material Polyester(PET) or Polyimide (PI), with high density traces layout, light weight, thin thickness, flexible, bendable etc features. Flex PCB can endure million times dynamic bending and folding which will not lead to trace damage. Flex PCB can be arbitrarily moved and stretched according to spacing arrangement to realize three-dimensional assembly, and then realize the integration assembly of components and traces on flex pcb.

Therefore, with the high-speed development of electronic products towards shorter, smaller, lighter, and thinner, the amount of FPC is increasing needed and used in aerospace, military, mobile communications, portable computers, computer peripherals, PDA, digital cameras (security camera circuit board), and other categories or products. JH PCBA can provide high-quality flexible circuit board manufacturing and assembly services.

Benefits of Flex PCB Fabrication

Excellent flexibility

The flexibility of flex PCBs is one of their key characteristics and advantages over traditional rigid PCBs. This unique attribute is achieved through the use of flexible materials, such as polyimide or polyester films, as the base substrate for the circuitry. The flexible nature of these materials allows flex PCBs to bend, fold, and twist without causing damage to the circuits or impacting their functionality.

Space and weight savings

Flex PCBs are thin and lightweight, allowing for compact designs that save space and reduce the overall weight of electronic devices, which is particularly important for aerospace, automotive, and wearable applications.

Durability

The flexible nature of flex PCBs makes them more resistant to shock, vibration, and mechanical stress, resulting in improved reliability and longer product life.

Improved heat dissipation

The thin and flexible materials used in flex PCBs offer better heat dissipation compared to traditional rigid PCBs, which can help maintain optimal performance and extend the life of electronic components.

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Flexible board production capacity

NO	type	item	parameter	drawing
01	manufact ure capacity	ayer count:	1-12L	/
		mixed stackup	FR-4+High frequency
		PCB thickness:	0.2-8mm	/
		hickness tolerance	≤1.0mm: +/-0.10mm, >.0mm:+/-10%.	/
02	manufact ure capacity	ayer count:	1-12L	/
		mixed stackup	FR-4+High frequency
		PCB thickness:	0.2-8mm	/
		hickness tolerance	≤1.0mm: +/-0.10mm, >.0mm:+/-10%.	/
03	manufact ure capacity	ayer count:	1-12L	/
		mixed stackup	FR-4+High frequency
		PCB thickness:	0.2-8mm	/
		hickness tolerance	≤1.0mm: +/-0.10mm, >.0mm:+/-10%.	/
04	manufact ure capacity	ayer count:	1-12L	/
		mixed stackup	FR-4+High frequency
		PCB thickness:	0.2-8mm	/
		hickness tolerance	≤1.0mm: +/-0.10mm, >.0mm:+/-10%.	/
05	manufact ure capacity	ayer count:	1-12L	/
		mixed stackup	FR-4+High frequency
		PCB thickness:	0.2-8mm	/
		hickness tolerance	≤1.0mm: +/-0.10mm, >.0mm:+/-10%.	/
06	manufact ure capacity	ayer count:	1-12L	/
		mixed stackup	FR-4+High frequency
		PCB thickness:	0.2-8mm	/
		hickness tolerance	≤1.0mm: +/-0.10mm, >.0mm:+/-10%.	/
07	manufact ure capacity	ayer count:	1-12L	/
		mixed stackup	FR-4+High frequency
		PCB thickness:	0.2-8mm	/
		hickness tolerance	≤1.0mm: +/-0.10mm, >.0mm:+/-10%.	/
08	manufact ure capacity	ayer count:	1-12L	/
		mixed stackup	FR-4+High frequency
		PCB thickness:	0.2-8mm	/
		hickness tolerance	≤1.0mm: +/-0.10mm, >.0mm:+/-10%.	/
09	manufact ure capacity	ayer count:	1-12L	/
		mixed stackup	FR-4+High frequency
		PCB thickness:	0.2-8mm	/
		hickness tolerance	≤1.0mm: +/-0.10mm, >.0mm:+/-10%.	/
10	manufact ure capacity	ayer count:	1-12L	/
		mixed stackup	FR-4+High frequency
		PCB thickness:	0.2-8mm	/
		hickness tolerance	≤1.0mm: +/-0.10mm, >.0mm:+/-10%.	/

Material for flexible circuit boards

Material for high frequency boards	Order share	Er, Dk- permittivity	Dk Loss Tangent	Tg	Td value	Thermal conductivity	CTE-z (T < Tg)	Electric Strength	Surace Resistivity	Peel strength
		@10GHz	@10GHz	°C	°C	W/m*K	ppm/°C	kV/mm	MO	N/mm
Rogers 4350BHF material	+++	3,5	0,0037	280°	390°	0,69	32	31	5,7 x 10^9	0,9
Rogers 4003CHF material	++	3,4	0,0027	280°	425°	0,71	46	31	4,2 x 10^9	1,1
Rogers 4003CHF material	+	3,6	0,004	185°	410°	–	45	–	1 x 10^8	0,8
Panasonic Megtron6HF material	+	3	0,0013	–	500°	0,5	25	–	1 x 10^7	2,2
Rogers RO3006PTFE ceramic-filled	o	6,2	0,002	–	500°	0,79	24	–	1 x 10^5	1,2
Rogers RO3010PTFE ceramic-filled	o	10	0,0022	–	500°	0,95	16	–	1 x 10^5	1,6
Taconic RF-35Ceramic	o	3,5*	0,0018*	315°	–	0,24	64	–	1,5 x 10^8	1,8
Taconic TLXPTFE	o	2,5	0,0019	–	–	0,19	135	–	1 x 10^7	2,1
Rogers RO3001Bonding Film for PTFE	–	2,3	0,003	160°	–	0,22	–	98	1 x 10^9	2,1
Taconic TLCPTFE	–	3,2	–	–	–	0,24	70	–	1 x 10^7	2,1