Quick Turn HDI PCB Manufacturer
6L,1 step HDI PCB,prototype,fastest 48h
10L,2-step HDI PCB,10 m2, fastest 10 days
8L,any layer connection HDI PCB, prototype, fastest 6 days
A variety of boards/processes, specializing in difficult boards that others can’t handle!
Order Size: 0.2㎡
Lead Time: 5 days
Order Size: 0.2㎡
Lead Time: 5 days
Order Size: 0.2㎡
Lead Time: 5 days
Order Size: 0.2㎡
Lead Time: 5 days
Order Size: 0.2㎡
Lead Time: 5 days
Order Size: 0.2㎡
Lead Time: 5 days
Order Size: 0.2㎡
Lead Time: 5 days
Order Size: 0.2㎡
Lead Time: 5 days
10L,2-step HDI PCB,10 m2, fastest 10 days
6L,1 step HDI PCB,prototype,fastest 48h
8L,any layer connection HDI PCB, prototype, fastest 6 days
For new customers to try our quick manufacturing service,
Free expedite fee or 50% deduction!
HDI PCB Structures | Microvia Categories | High-Volume Production | Small To Medium-Volume Production | Prototype | Availability |
---|---|---|---|---|---|
1+N+1 | Blind vias | Yes | Yes | Yes | Over 4 layers |
2+N+2 | Blind/buried staggered vias | Yes | Yes | Yes | Over 6 layers |
2+N+2 | Blind/buried stacked vias | Yes | Yes | Yes | Over 6 layers |
3+N+3 | Blind/buried stacked vias | / | Yes | Yes | Over 8 layers |
3+N+3 | Blind/buried stacked vias | / | / | Yes | Over 8 layers |
HDI PCB Structures | Microvia Categories | High-Volume Production | Small To Medium-Volume Production | Prototype | Availability |
---|---|---|---|---|---|
1+N+1 | Blind vias | Yes | Yes | Yes | Over 4 layers |
2+N+2 | Blind/buried staggered vias | Yes | Yes | Yes | Over 6 layers |
2+N+2 | Blind/buried stacked vias | Yes | Yes | Yes | Over 6 layers |
3+N+3 | Blind/buried stacked vias | / | Yes | Yes | Over 8 layers |
3+N+3 | Blind/buried stacked vias | / | / | Yes | Over 8 layers |
Serial No | Item | Technical Parameters |
---|---|---|
1 | Base Material | FR-4 | High Tg | Halogen-free | PTFE | Ceramic PCB | Polyimide |
2 | Board Type | PCB | FPC | R-FPC | HDI |
3 | Hignest Layer | 64Layer |
4 | Minimum base copper thickness | 1/3 OZ ( 12um ) |
5 | Maximum finished copper thickness | 8 OZ |
6 | Minimum trace / gap (Inner layer) | 2/2mil (H/H OZ base copper) |
7 | Maximum produce size | 609*889mm |
8 | Minimum trace / gap (Outer layer) | 2/2mil (1/3 OZ base copper) |
9 | Minimum distance from hole to inner conductor | 6mil |
10 | Minimum distance from hole to outer conductor | 6mil |