High Frequency PCB

JH PCBA Rigid-Flex PCB

Mature different kind HF material mixed lamination technology: FR4+PTFE,FR4+408HR,FR4+ROGERS

3mil/3mil min trace w/s, impedance control tolerance within ±8%

Materials available: rogers, Shengyi, taconic, teflon, arlon, etc.

What is High Frequency (HF) PCB?

High Frequency (HF) PCB is that kind special circuit boards with high frequency > 1GHz, with relative high purchase price. The physical properties, precision, technology parameters requests of high frequency PCB is quite high, normally used in cars collision avoidance system, satellite system, 5G base station communication devices etc fields.

Keep them in mind when choosing high frequency PCB

1.Dielectric constant(Dk)

DK should be small and stable enough, usually the smaller the better, high DK may lead to signal transmission delay.

2.Dissipation Factor(Df)

DK should be small and stable enough, usually the smaller the better, high DK may lead to signal transmission delay.

3.Coefficient of thermal expansion

The Coefficient of thermal expansion should be the same with copper foil as much as possible because the difference will lead to copper foil separated in the changes of cold and heat.

4.Moisture Resistance

Moisture absorption must be low, or will result in Dk and Df loss when in a wet environment.

Why choose JH PCBA to manufacture High Frequency PCB for you?

01. High quality material as high quality guarantee basis

Establish strategy long time partnership cooperation with famous material manufacturers, such as Rogers, Shengyi, Taconic, Teflon, Arlon, etc.

02. Equipped with full manufacturing equipment for communication industry PCB

Plasma desmear machine and VCP plating line to provide excellent uniformity of barrel copper thickness and high consistency of impedance value.

03. Exquisite technology to meet high quality communication PCBs request

Exquisite technology to meet high quality communication PCBs request

3mil/3mil min trace w/s, impedance control tolerance within ±8%

04. Professional technology engineers good at the details how to control HF PCB good quality, such as:

A.Before solder mask, HF boards can’t be scrubbed, or will leads to poor adhesive force, so micro-etch by chemicals is the best way of coarsening.

B.Most material of HF PCB are PTFE, using normal milling cutter will cause much tiny burrs, so we use special double edged milling cutter to guarantee slot size tolerance ±0.1mm and prevents tiny burrs.

C.The impedance control and trace width/spacing requests of HF PCB is quite strict, the tolerance just about 2%.

D.The copper adhesive force is not ideal because high frequency material special features when PTH process, so before PTH, all vias and boards surface need coarsening preprocessing by using plasma and so on advanced equipment to improve PTH hole copper and solder mask adhesive force.

Capability of High Frequency PCB

NO	Type	Item	Parameter	Drawing
01	manufact ure capacity	ayer count:	1-12L	/
		mixed stackup	FR-4+High frequency
		PCB thickness:	0.2-8mm	/
		hickness tolerance	≤1.0mm: +/-0.10mm, >.0mm:+/-10%.	/
02	manufact ure capacity	ayer count:	1-12L	/
		mixed stackup	FR-4+High frequency
		PCB thickness:	0.2-8mm	/
		hickness tolerance	≤1.0mm: +/-0.10mm, >.0mm:+/-10%.	/
03	manufact ure capacity	ayer count:	1-12L	/
		mixed stackup	FR-4+High frequency
		PCB thickness:	0.2-8mm	/
		hickness tolerance	≤1.0mm: +/-0.10mm, >.0mm:+/-10%.	/
04	manufact ure capacity	ayer count:	1-12L	/
		mixed stackup	FR-4+High frequency
		PCB thickness:	0.2-8mm	/
		hickness tolerance	≤1.0mm: +/-0.10mm, >.0mm:+/-10%.	/
05	manufact ure capacity	ayer count:	1-12L	/
		mixed stackup	FR-4+High frequency
		PCB thickness:	0.2-8mm	/
		hickness tolerance	≤1.0mm: +/-0.10mm, >.0mm:+/-10%.	/
06	manufact ure capacity	ayer count:	1-12L	/
		mixed stackup	FR-4+High frequency
		PCB thickness:	0.2-8mm	/
		hickness tolerance	≤1.0mm: +/-0.10mm, >.0mm:+/-10%.	/
07	manufact ure capacity	ayer count:	1-12L	/
		mixed stackup	FR-4+High frequency
		PCB thickness:	0.2-8mm	/
		hickness tolerance	≤1.0mm: +/-0.10mm, >.0mm:+/-10%.	/
08	manufact ure capacity	ayer count:	1-12L	/
		mixed stackup	FR-4+High frequency
		PCB thickness:	0.2-8mm	/
		hickness tolerance	≤1.0mm: +/-0.10mm, >.0mm:+/-10%.	/
09	manufact ure capacity	ayer count:	1-12L	/
		mixed stackup	FR-4+High frequency
		PCB thickness:	0.2-8mm	/
		hickness tolerance	≤1.0mm: +/-0.10mm, >.0mm:+/-10%.	/
10	manufact ure capacity	ayer count:	1-12L	/
		mixed stackup	FR-4+High frequency
		PCB thickness:	0.2-8mm	/
		hickness tolerance	≤1.0mm: +/-0.10mm, >.0mm:+/-10%.	/

Material for High Frequency PCB

Material for high frequency boards	Order share	Er, Dk- permittivity	Dk Loss Tangent	Tg	Td value	Thermal conductivity	CTE-z (T < Tg)	Electric Strength	Surace Resistivity	Peel strength
		@10GHz	@10GHz	°C	°C	W/m*K	ppm/°C	kV/mm	MO	N/mm
Rogers 4350BHF material	+++	3,5	0,0037	280°	390°	0,69	32	31	5,7 x 10^9	0,9
Rogers 4003CHF material	++	3,4	0,0027	280°	425°	0,71	46	31	4,2 x 10^9	1,1
Rogers 4003CHF material	+	3,6	0,004	185°	410°	–	45	–	1 x 10^8	0,8
Panasonic Megtron6HF material	+	3	0,0013	–	500°	0,5	25	–	1 x 10^7	2,2
Rogers RO3006PTFE ceramic-filled	o	6,2	0,002	–	500°	0,79	24	–	1 x 10^5	1,2
Rogers RO3010PTFE ceramic-filled	o	10	0,0022	–	500°	0,95	16	–	1 x 10^5	1,6
Taconic RF-35Ceramic	o	3,5*	0,0018*	315°	–	0,24	64	–	1,5 x 10^8	1,8
Taconic TLXPTFE	o	2,5	0,0019	–	–	0,19	135	–	1 x 10^7	2,1
Rogers RO3001Bonding Film for PTFE	–	2,3	0,003	160°	–	0,22	–	98	1 x 10^9	2,1
Taconic TLCPTFE	–	3,2	–	–	–	0,24	70	–	1 x 10^7	2,1