MCPCB Ceramics PCB

JH PCBA MCPCB, Metal Core PCB, IMS (Isolated Metal Substrate)

Manufacture 1-4 Layer aluminum and copper PCB, thermal Conductivity of aluminum PCB: 1- 5w, thermal Conductivity of thermal-electric separation copper PCB: 150W-300W; Special Material: Bergquist, Japan Sumitomo, PTTC, and so on.

What is MCPCB?

Metal core pcb is abbreviated as MCPCB, also named as IMS (Isolated Metal Substrate). It is made of thermal insulating layer, metal plate and metal copper foil, which has special magnetic conductivity, excellent heat dissipation, high mechanical strength and good processing performance.

For metal core base material, there is aluminum and copper base materials. Aluminum substrate is a kind of metal-based copper clad plate with good heat transferring and dissipation function. Copper substrate has better performance than aluminum, but its price is relatively more expensive than aluminum.

Clients order aluminum pcbs more often, because the price of aluminum pcb is much more economic, they are used in cars on indicators, in headlights and brake lights, and other automotive applications, medical equipment high power LED lighting and communication electronic equipment and so on.

Aluminum PCB with counterbores

Copper PCB with ENIG surface finishing

What kind of MCPCB JH PCBA can provide?

1, MCPCB we can provide as:
   a.Aluminum-based PCB
   b.Copper-based PCB
   c.Ceramic-based PCB
   d.Others: Iron-based PCB

2, Various brand material available:
ITEQ Bergquist TOTKING Ventec PTTC
CCAF CHIN-SHI KunShan Uniplus Japan Sumitomo

3, Featured MCPCB JH PCBA can provide:
   a.Thermal-electric separation copper-based pcb: 150W-300W high power miner lamp and streetlight.

   b.COB silver mirror aluminum PCB: after assembly, lights reflectivity up to 98%, luminous efficiency up to 120 LM.
   c.Ceramic-based pcb: thermal conductivity about 26W, withstand high voltage to 8000-10000V.

4,Taiyo white color solder mask used for our MCPCB, with high adhesive force, with high reflectivity, reach 85%.

JH PCBA MCPCB Manufacturing Capability

Type	Item	Parameter	Drawing
manufact ure capacity	ayer count:	1-12L	/
	mixed stackup	FR-4+aluminum substrate FR-4+copper substrate	/
	PCB thickness	aluminum substrate 0.6-5.0mm copper substrate 0.6-3.0mm	/
	thickness tolerance	≤1.0mm: +/-0.10mm, >.0mm:+/-10%.	/
	minimum pcb size	2.5×2.5mm need create panel, 10x10mm cando single board.	/
	minimum pcb size	500x1200mm	/
	maximum copper	30z	/
manufact ure capacity1	ayer count:	1-12L	/
	mixed stackup	FR-4+aluminum substrate FR-4+copper substrate	/
	PCB thickness	aluminum substrate 0.6-5.0mm copper substrate 0.6-3.0mm	/
	thickness tolerance	≤1.0mm: +/-0.10mm, >.0mm:+/-10%.	/
	minimum pcb size	2.5×2.5mm need create panel, 10x10mm cando single board.	/
	minimum pcb size	500x1200mm	/
	maximum copper	30z	/

Material for MCPCB

Material for high frequency boards	Order share	Er, Dk- permittivity	Dk Loss Tangent	Tg	Td value	Thermal conductivity	CTE-z (T < Tg)	Electric Strength	Surace Resistivity	Peel strength
		@10GHz	@10GHz	°C	°C	W/m*K	ppm/°C	kV/mm	MO	N/mm
Rogers 4350BHF material	+++	3,5	0,0037	280°	390°	0,69	32	31	5,7 x 10^9	0,9
Rogers 4003CHF material	++	3,4	0,0027	280°	425°	0,71	46	31	4,2 x 10^9	1,1
Rogers 4003CHF material	+	3,6	0,004	185°	410°	–	45	–	1 x 10^8	0,8
Panasonic Megtron6HF material	+	3	0,0013	–	500°	0,5	25	–	1 x 10^7	2,2
Rogers RO3006PTFE ceramic-filled	o	6,2	0,002	–	500°	0,79	24	–	1 x 10^5	1,2
Rogers RO3010PTFE ceramic-filled	o	10	0,0022	–	500°	0,95	16	–	1 x 10^5	1,6
Taconic RF-35Ceramic	o	3,5*	0,0018*	315°	–	0,24	64	–	1,5 x 10^8	1,8
Taconic TLXPTFE	o	2,5	0,0019	–	–	0,19	135	–	1 x 10^7	2,1
Rogers RO3001Bonding Film for PTFE	–	2,3	0,003	160°	–	0,22	–	98	1 x 10^9	2,1
Taconic TLCPTFE	–	3,2	–	–	–	0,24	70	–	1 x 10^7	2,1

Construction and Manufacturing Process for MCPCB

Single sided 1L Metal Core PCB

Sheet Cutting—Drilling—Circuit—Etch—Solder mask—Silkscreen—Surface Finishing—Forming—Test

Single sided 2L Metal Core PCB

Sheet Cutting(FR4)—Drilling—PTH—Circuit—Plating—Etch—Test—Laminating(FR4+Metal Core)—Solder mask—Silkscreen—Surface—2nd Drilling—Forming—Test

Double sided 2L Metal Core PCB

Sheet Cutting(FR4)—Drilling—PTH—Circuit—Plating—Etch—Test—Laminating(FR4+Metal Core)—Solder mask—Silkscreen—Surface—2nd Drilling—Forming—Test

Double sided 2L Metal Core PCB with insulating holes

Sheeting Cutting—Drilling(Drill resin hole)—plug resin—Laminate(laminate surface copper)—Drilling(Drill actual size hole)—PTH— Circuit—Plating—Etch—Solder mask—Silkscreen—Surface Finishing—2nd Drilling—Forming—Test