Multi-layer PCB Capability

FR-4 PCB Capabilities

No.	Item	Manufacturing Capabilities	Illustration
1	Material	FR-4 (Fiberglass)	Please check below Material List
2	Number of Layers	1 Layer, 2 Layers, 4 Layers, 6 Layer, 8 Layers,10 Layers	Standard stackup for multilayer pcbs.
3	TG Grade	TG130~140, TG150~160, TG170~180
4	Max PCB Size	1 layer & 2 layers: 1200300mm or 600500mmMulti-layers: 600*500mm
5	Min PCB Size	5mm*5mm
6	Board Size Tolerance(Outline)	±0.2mm(CNC routing)±0.5mm(V-scoring)
7	Surface Finish	HASL with lead, HASL lead free, Immersion gold(ENIG), OSP, Hard gold, ENEPIG, Immersion silver (Ag), None
8	Board Thickness	1 Layer/2 Layers: 0.2~2.4mm4 Layers: 0.4~2.4mm6 Layers: 0.8~2.4mm8 Layers: 1.0~2.4mm10 Layers: 1.2~2.4mm Note: Customized PCB thickness and Layer stackup are acceptable.
9	Board Thickness Tolerance	Thickness≥1.0mm: ±10%Thickness<1.0mm: ±0.1mm Note: Normally “+ Tolerance” will occur due to PCB processing steps such as electroless copper, solder mask and other types of finish on the surface.
10	Outer Layer Copper Thickness	1oz/2oz/3oz(35μm/70μm/105μm) Note: 2ozPCB thickness≥1.2mm,Via size≥0.25mm,Min Track/Spacing≥0.15mm 3ozPCB thickness≥2.0mm,Via size≥0.3mm,Min Track/Spacing≥0.2mm
11	Inner Layer Copper Thickness	1oz/1.5oz(35μm/50μm)
12	Outer layer Min track/spacing	≥3mil
13	Inner layer Min track/spacing	≥4mil
14	Annular Ring Size	≥0.13mm
15	Grid Line track/spacing	≥0.2mm
16	Coil board Line track/spacing	≥0.2mm
17	BGA pad size	≥0.25mm
18	BGA Distance	≥0.12mm
19	Board Outlines	Track to Outline: ≥0.3mm Trace to V-cut line: ≥0.4mm
20	Finished Hole Size Tolerance	±0.08mm
21	Finished Hole Diameter(CNC)	0.2mm~6.3mm 1. PCB Thickness=2.0mm, Minhole size is 0.3mm2. PCB Thickness=2.4mm, Min hole size is 0.4mm3. Copper Thickness=2OZ, Min hole size is 0.25mm4. Copper Thickness=3OZ, Min hole size is 0.3mm
22	TH Via Distance	Same nets: 0.15mmDifferent net: 0.25mm
23	Plated Slot Size	≥0.5mm Note:L:W=2.5: 1 (Should be 2.5:1 or higher. If it is less than this, the holes may be misaligned.) If you can’t draw a long hole in your design, you can draw a continuous round hole and it will be regarded as a long hole. Also, it is okay to draw the oblong hole in Profile Layer instead of Drilling Layer.
24	Castellated Holes	≥0.6mm
25	Non-Plated Holes	≥0.8mm
26	NPTH to Copper Line	≥0.2mm
27	Soldermask	Green, Red, Yellow, White, Black, Blue, Purple, Matte Green,Matte Black,None
28	Soldermask Thickness	20~30um
29	Soldermask Bridge	Green: ≥0.1mmOthers: ≥0.15mm
30	Soldermask to soldering pad distance	≥0.05mm
31	Silkscreen	White, Black, Yellow, None
32	Minimum Character Width(Legend)	≥0.15mm Note: Characters of less than 0.15mm wide will be too narrow to be identifiable.
33	Minimum Character Height (Legend)	≥0.75mm Note: Characters of less than 0.8mm high will be too small to be recognizable.
34	Character Width to Height Ratio (Legend)	1: 5 (In PCB silkscreen legends processing, 1:5 is the most suitable ratio)
35	Silkscreen to Soldering Pad Distance	≥0.1mm
36	V-cut Line	≥70mm Note:PCB thickness≥0.6mmDetails refer to right side picture
37	V-cut Line Distance	≥3.5mm
38	Distance betwen Board to Board	≥0.8mm
39	Stamp-hole Width	≥2.0mm Note: PCB size and thickness are subject to review by PCBGOGO.
40	Tab-route Width	≥1.6mm Note: PCB size and thickness are subject to review by PCBGOGO.
41	Edge Rail	≥3.5mm Note: If choosing panel by PCBGOGO, we will add 5mm edge rails on both sides by default.
42	Gold Finger	Bevelling Angle: 30～45°Depth: ≥1mmLength: 45mm～280mm Note: Board thickness≥1.2mm
43	Special Specification	Impedance controlCustom Layer StackupInterstitial Via Hole(IVH)Via in padVia filled with resinCountersinks/CounterboresCarbon MaskHalogen-FreeZ-axis millingEdge PlatingOthers